MOS fab capabilities over the years?

From: Nate Lawson <>
Date: Fri, 22 Nov 2013 22:27:41 -0800
Message-Id: <>
Has anyone documented the various revisions of the MOS fab throughout the years?

I'm wondering when they switched processes, scaling, CAD tools, and any use of third-party fabs for CBM designs. For example, I believe the early 90's Amiga chips were fabbed by HP or IBM, possibly.

Also, were they running multiple feature sizes concurrently? Certainly there's the 6052/VIC-II/SID variations, for example.

You can guess a lot of this by just looking at the chips throughout the years, but I'm looking for more detail.


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Received on 2013-11-23 07:00:41

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