MOS fab capabilities over the years?

From: Nate Lawson <nate_at_root.org>
Date: Fri, 22 Nov 2013 22:27:41 -0800
Message-Id: <B37B205F-5D82-4B81-929C-46ADD43D5F03@root.org>
Has anyone documented the various revisions of the MOS fab throughout the years?

I'm wondering when they switched processes, scaling, CAD tools, and any use of third-party fabs for CBM designs. For example, I believe the early 90's Amiga chips were fabbed by HP or IBM, possibly.

Also, were they running multiple feature sizes concurrently? Certainly there's the 6052/VIC-II/SID variations, for example.

You can guess a lot of this by just looking at the chips throughout the years, but I'm looking for more detail.

Thanks,
Nate


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