Has anyone documented the various revisions of the MOS fab throughout the years? I'm wondering when they switched processes, scaling, CAD tools, and any use of third-party fabs for CBM designs. For example, I believe the early 90's Amiga chips were fabbed by HP or IBM, possibly. Also, were they running multiple feature sizes concurrently? Certainly there's the 6052/VIC-II/SID variations, for example. You can guess a lot of this by just looking at the chips throughout the years, but I'm looking for more detail. Thanks, Nate Message was sent through the cbm-hackers mailing listReceived on 2013-11-23 07:00:41
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