On 10/30/2011 08:38 PM, Pasi 'Albert' Ojala wrote: > Yes, they had their own fab, the process was much faster and easier then > (0.8microns?, 3 metals?), and they probably had their own bonding > machines to get the dies quickly into packages (ceramic for protos?). I think you need to shift that dot... The chips for the C64 were made in something around 6 microns... > We poor Finnish design companies have to account for (multi-product > wafer for prototyping) processing timetables (mask production, > processing), fab schedules, package assembly and shipping times. :-) Well, no one said that not having an in house fab didn't have any disadvantages. :) Gerrit Message was sent through the cbm-hackers mailing listReceived on 2011-10-30 20:00:26
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