Re: 264/TED/Plus4 Story

From: Pasi 'Albert' Ojala <>
Date: Sun, 30 Oct 2011 21:38:02 +0200
Message-ID: <>
On 10/30/11 19:00, Gerrit Heitsch wrote:
> From what I have read on the net so far, back then MOS had a much 
> faster turn around time to make a new revision which allowed the chip 
> designers to get a new revision much faster.

Yes, they had their own fab, the process was much faster and easier then 
(0.8microns?, 3 metals?), and they probably had their own bonding 
machines to get the dies quickly into packages (ceramic for protos?).

We poor Finnish design companies have to account for (multi-product 
wafer for prototyping) processing timetables (mask production, 
processing), fab schedules, package assembly and shipping times. :-)


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Received on 2011-10-30 20:00:21

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