Re: Peel and stick heat-sinks

From: Justin <shadow_at_darksideresearch.com>
Date: Mon, 27 Feb 2012 18:01:27 -0500
Message-Id: <90327627-E1AC-4A28-88BA-BCE136D2667B@darksideresearch.com>
Ditto, I had a ton if then and put them on every chip in a 128DCR and an SX64 with no problems.  It probably is not as good a thermal transfer as high quality thermal grease, but the W/cm^2 for these chips really isn't that high.

Justin

On Feb 27, 2012, at 17:51, Marc Honey <mhoney@gmail.com> wrote:

> I have used the peel and stick heat sinks with great success.  If you want to make things even better (but permanent) then use epoxy.
> 
> Epoxy -  http://gallery.remotecpu.com/index.php/Commodore-Collection/100_2764 
> 
> Peel and stick - http://gallery.remotecpu.com/index.php/Commodore-Collection/100_2639 
> 
> Marc
> 
> On Mon, Feb 27, 2012 at 4:36 PM, Crock <crock@clarke-family.org.uk> wrote:
> Hi Luke - Yes I have, they are OK, but not great.  But then again something is better than nothing. :-)
> 
> A much better option is two-part thermal adhesive. Both Zalman and Arctic Silver sell one.
> 
> Rob
> 
> 
> 
> On 27/02/2012 22:05, Luke Crook wrote:
> Has anyone used the peel and stick heat-sinks in a C64?  Are these heat-sinks any good?
> 
> 
> 
> 
> 
>      Message was sent through the cbm-hackers mailing list
> 


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Received on 2012-02-28 00:00:10

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