> Those companies were licensed to make the chips based on the same > design > in order to be a second-source option, so I assume the die is > identical. It is almost identical. I'm not sure if I have seen a Synertek chip; but the Rockwell chips have a different layout around the pads, it looks to me that they wanted more clearance around the pads (the MOS parts have much less clearance than anything else I've seen). There is also an extra (redundant) contact from metal to active area, on the DBE signal. Oh, and the Rockwell chip has the ground pads doubled, and it has different test structures. For most purposes, the chips are identical. Segher Message was sent through the cbm-hackers mailing listReceived on 2011-11-04 20:00:13
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